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金居不斷追求企業之長期生存與發展,對銅箔事業有長遠之承諾,並做長期投資之準備、一流設備及產能的擴充、新技術的開發,以因應客戶的需要。


產品應用如下:


Co-Tech Product Lineup

Main Customer

Application

Material

Product

Treated side Rz(um)

CCL/PCB

Outer layer
IT、3C Products
HDI
LED car lighting module

Stand Loss

LP310/LP410

≦ 9.5(1oz)
≦ 7.2(Hoz)

mid-Loss & Low Loss

HG310

≦ 8.0(1oz)
≦ 6.0(Hoz)

Very Low Loss & Ultra Low Loss

SLD01

≦ 3.0

Inner layer
Server
Switch
Storage
Rigid-Flex PCB
Touch module
3D face recognition
Automotive market

mid-Loss & Low Loss

RT311

≦ 3.0

RG311
(Advanced RTF)

≦ 2.3

Very Low loss

VL410(HVLP)

≦ 2.0

Ultra Low Loss

RG312
(Advanced RTF)

≦ 2.1

VG410(HVLP2)

≦ 1.5

VL411(HVLP3)

≦ 1.0

Ultra Low Loss II

PF510

≦ 0.5

PF511

N.P.

High frequency
5G Antenna Radar
ADAS

PTFE

RF313(RTF)

≦ 3.0

VF413(HVLP2)

≦ 1.5

Hydrocarbon

LH408(HTE)

≦ 9.5

IC Substrate

BT

RP410(VLP)

≦ 3.0

FCCL/FPCB

Casting FCCL
HDI/Rigid-Flex Board
/Touch module

Epoxy

FC310(HTE)

≦ 4.5(Toz)
≦ 5.5(Hoz)
≦ 8.0(1oz)

PI

RC313(RTF)

≦ 3.0

FC450(HVLP)

≦ 2.5

Laminate FCCL
Wearable devices /VR
Augmented Reality
Mobile terminal
3D face recognition
communication module

Kaneka Film
UBE Film

RV312(RTF)

≦ 2.5

FL450(HVLP2)

≦ 2.0

MPI

RL450(RTF)

≦ 2.5

Laminate FCCL
5G Antenna
Radar
ADAS

LCP Film

FL451

≦ 1.5




 



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